Pioneering approach makes compact, cost-effective, high-resolution multispectral shortwave infrared (SWIR) sensors accessible ...

CEA-Leti has achieved a major milestone for next-generation chip stacking: fully functional 2.5 V SOI CMOS devices fabricated ...

Austriamicrosystems (www.austriamicrosystems.com) has introduced its 50V CMOS high voltage (HV) process, a fully modular proprietary extension of the 0.35 mum CMOS technology that enables high ...

Geneva, June 15, 2011 - STMicroelectronics (NYSE: STM) and CMP (Circuits Multi Projets®) today announced that the CMOS 28nm process from STMicroelectronics is now available for prototyping to ...

Newport Beach, CA—Jazz Semiconductor announced the availability of a 17-GHz vertical PNP (VPNP) module on its 0.18um RFCMOS platform. The addition of the VPNP module to its RFCMOS platform enables the ...

Jazz Semiconductor, an independent wafer foundry focused primarily on specialty CMOS process technologies, today announced the availability of 0.5 micron BCD process technology targeted for power ...

Described as revolutionary, the company’s iCMOS process technology combines high-voltage silicon with sub-micron CMOS and complementary bipolar technologies to yield analog devices capable of ...

A Grenoble, France-based research team at CEA Leti and chip maker STMicroelectronics say that they have demonstrated the first hybrid III-V/silicon laser to be fabricated using a wafer manufacturing ...

Imec has demonstrated the integration of colloidal quantum dot photodiodes (QDPDs) on metasurfaces developed on its 300 mm CMOS pilot line.