High-performance computing, 6G communication, autonomous vehicle chips, and consumer electronics are all key markets that benefit from advancing semiconductor packaging. IDTechEx's report, "Advanced ...

Designing energy-efficient systems that meet the high bandwidth demands of high-performance computing (HPC) involves key trends in silicon technology: increasing transistor density, enhancing memory ...

The MarketWatch News Department was not involved in the creation of this content. BOSTON, July 24, 2024 /PRNewswire/ -- Over the past decade, the capacity of data center Ethernet switches has surged ...

BOSTON--(BUSINESS WIRE)--Advanced microelectronics are moving on from the Moore’s Law era to be “more-than-Moore”. Denser chips have higher internal and external clock rates, and higher power ...

Antenna packaging methodologies have evolved significantly to counter the escalating signal attenuation in high-frequency communications like 5G mmWave and anticipated 6G networks. Benchmark of ...

Oct. 23, 2024 — A new IDTechEx report, “Chiplet Technology 2025-2035: Technology, Opportunities, Applications,” highlights the transformative potential of chiplets. It predicts the market will reach ...