Samsung Electronics introduced a full line-up of chip-scale LED packages (CSP), including 0.6-W-class and 3-W-class packages, CSP arrays, and PoW (Phosphor on Wafer) packages. Samsung’s CSP technology ...

WEST LAFAYETTE, Ind. – Purdue University researchers have developed a large-scale manufacturing process that may change the way some grocery store foods are packaged. According to Credence Research, ...