Different materials are used to make packaging in various shapes depending on the products it is intended to protect. Some forms of packaging include sealed bags to maintain the freshness of food, ...

The limits of monolithic integration, together with advances in chip interconnect and packaging technologies, have spurred the growth of heterogeneous advanced packaging where multiple dies are ...

TSMC's Advanced Backend Fab 6, the foundry's first all-in-one automated advanced packaging and testing fab to realize 3DFabric front-end to back-end process and testing services integration, has ...